JPS6049698A - プリント基板の接続方法 - Google Patents
プリント基板の接続方法Info
- Publication number
- JPS6049698A JPS6049698A JP15691783A JP15691783A JPS6049698A JP S6049698 A JPS6049698 A JP S6049698A JP 15691783 A JP15691783 A JP 15691783A JP 15691783 A JP15691783 A JP 15691783A JP S6049698 A JPS6049698 A JP S6049698A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connection
- solder cream
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 239000006071 cream Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 description 10
- 239000012787 coverlay film Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15691783A JPS6049698A (ja) | 1983-08-27 | 1983-08-27 | プリント基板の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15691783A JPS6049698A (ja) | 1983-08-27 | 1983-08-27 | プリント基板の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6049698A true JPS6049698A (ja) | 1985-03-18 |
| JPH0455360B2 JPH0455360B2 (en]) | 1992-09-03 |
Family
ID=15638196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15691783A Granted JPS6049698A (ja) | 1983-08-27 | 1983-08-27 | プリント基板の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6049698A (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258079U (en]) * | 1985-09-28 | 1987-04-10 | ||
| JPS63127595A (ja) * | 1986-11-17 | 1988-05-31 | オムロン株式会社 | プリント基板の接続方法 |
| JP2015177082A (ja) * | 2014-03-17 | 2015-10-05 | 岡谷電機産業株式会社 | 基板間接続構造 |
| EP3751969A2 (en) | 2019-04-26 | 2020-12-16 | Nichia Corporation | Method of manufacturing light-emitting module and light-emitting module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5016863A (en]) * | 1973-06-20 | 1975-02-21 | ||
| JPS57162493A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
| JPS5863195A (ja) * | 1981-10-12 | 1983-04-14 | オリンパス光学工業株式会社 | パタ−ン接続方法 |
-
1983
- 1983-08-27 JP JP15691783A patent/JPS6049698A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5016863A (en]) * | 1973-06-20 | 1975-02-21 | ||
| JPS57162493A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
| JPS5863195A (ja) * | 1981-10-12 | 1983-04-14 | オリンパス光学工業株式会社 | パタ−ン接続方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258079U (en]) * | 1985-09-28 | 1987-04-10 | ||
| JPS63127595A (ja) * | 1986-11-17 | 1988-05-31 | オムロン株式会社 | プリント基板の接続方法 |
| JP2015177082A (ja) * | 2014-03-17 | 2015-10-05 | 岡谷電機産業株式会社 | 基板間接続構造 |
| EP3751969A2 (en) | 2019-04-26 | 2020-12-16 | Nichia Corporation | Method of manufacturing light-emitting module and light-emitting module |
| US11264533B2 (en) | 2019-04-26 | 2022-03-01 | Nichia Corporation | Method of manufacturing light-emitting module and light-emitting module |
| US11611014B2 (en) | 2019-04-26 | 2023-03-21 | Nichia Corporation | Light-emitting module |
| EP4411206A2 (en) | 2019-04-26 | 2024-08-07 | Nichia Corporation | Method of manufacturing light-emitting module and light-emitting module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455360B2 (en]) | 1992-09-03 |
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